Chip Cutting Solution
Hirundo's Chip Cutting Solution delivers unparalleled precision for optical and electronic components, empowering industries like telecom, 5G, and data centers. Using advanced laser technology, we ensure clean, efficient cuts for chips, wafers, and fiber optic assemblies, meeting the demands of modern connectivity.
Hirundo haveΒ ultra-short pulse width laser equipment for diffrent materials cutting

FWDMοΌCWDM οΌMWDMοΌLWDMοΌDWDM filters cutting

CWDM4 ,LWDM4 and LWDM8 AWG chips cutting

PLC wafer cutting

DWDM AWG wafer cutting

Special-shaped ceramic cutting

Cutting and chamfering of various glass materials

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